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Credo
2020/03/06

Credo Announces HiWire CLOS AEC at 2020 OCP Global Summit

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Thin, Low Power 400G Interconnect Enables Next Gen Disaggregated Chassis Deployments

Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology which delivers high performance, low power connectivity solutions for 100G, 400G, and 800G port enabled networks, today announced at the Open Compute Project (OCP) Global Summit, a new addition to the 400G HiWire™ family – the HiWire™ CLOS AEC (Active Electrical Cable) specifically designed for Distributed, Disaggregated Chassis (DDC). HiWire CLOS AECs will be demonstrated live in the OCP Experience Center at the 2020 Open Compute Project (OCP) Global Summit on March 4-5, 2020 in the San Jose Convention Center.

The HiWire CLOS AECs in DDC implementations:
  • Low Power
    Starting at only 4.5W per end today and migrating to 2.5W per end in Q4- 2020, they consume up to 75% less power than optical solutions
  • Compact
    Takes up to 75% less volume than DACs with densities of up to 500 cables per rack

CLOS AECs can replace the backplane of a chassis to enable the plug-&-play connection of commodity 400G “Pizza Box” switches and routers. Credo’s HiWire CLOS AECs join the existing families of HiWire SPAN AECs, which replace AOCs, and HiWire SHIFT AECs, which provide plug & play PAM4-to-NRZ speed shifting in cable.

“As next-generation switching ASICs mature, opportunities arise that leverage the power density to deploy dense disaggregated chassis DDC solutions,” said Jeff Twombly, Vice President of Business Development at Credo. “We developed our low power, highly flexible and routable 400G HiWire CLOS AEC interconnect to standardize and proliferate 400G disaggregated chassis configurations at hyperscalers and service providers around the world.”

Gerald Degrace, Head PM for Host NIC, Switching, SONiC and WAN, Microsoft Azure Networking, Microsoft Corp (NASDAQ: MSFT). said, “Low power, high speed interconnects are a critical piece in our goal of enabling open source software and DDC architectures in the hyperscale datacenter. Credo’s HiWire CLOS AEC solutions allow DDCs to be assembled without the physical routing problems of 400G DAC or the high power of optical interconnect.”  (Source: Credo website)
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