QSFP-DD (Double Density) Interconnect System and Cable Assemblies

QSFP-DD Interconnect System’s 8-lane electrical interface transmits up to 28 Gbps NRZ or 56 Gbps PAM-4, up to 200 or 400 Gbps aggregate, with the same module form factor as QSFP Interconnects, making them backward compatible
QSFP-DD (Double Density) Interconnect System and Cable Assemblies
Telecommunication and data center customers have increasing bandwidth requirements and, therefore, require high-density interconnects. QSFP-DD Interconnect System enables faceplate density equal to the current 2x1 QSFP form factor, but with 8-lane ports. In other words, a total of 256 differential pairs with 32 ports delivers double-lane density within the same form factor. 

  • 28 Gbps NRZ and 56 Gbps PAM4
    • Meets or exceeds current requirements for 200-Gigabit Ethernet and InfiniBand 100-Gigabit (EDR) applications
    • Supports legacy 10 Gbps Ethernet, 14 Gbps (FDR) InfiniBand and 16 Gbps Fibre Channel applications
  • Preferential coupling design uses a narrow-edge coupled, blanked- and formed-contact geometry and insert molding
    • Provides superior signal integrity (SI) performance, including extremely low insertion loss (IL)
  • Surface-mount technology (SMT) design available
    • Provides the option for placement on both sides of the PCB
  • Stacked integrated connectors and cages are available in 2-by-1 configuration
    • Supports pluggable applications
  • Fully integrated design
    • Incorporates all components (backshells, cable, populated PCBs) from Molex
    • Ensures high-quality components are compiled into a comprehensive solution with a superior cost structure
  • Identical mating interface as the QSFP+ connector for backward compatibility
    • Protects end user's current QSFP+ infrastructure investment
  • Nickel-plated heat sink
    • Provides increased thermal transfer from module to heat sink
  • 0.80mm-pitch host connector designed for placement beneath EMI cage
    • Supports pluggable applications
  • QSFP-DD Cable Assemblies
    • Temp-Flex cable technology
    • Boosts electrical performanceProvides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies
  • Meets IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications
    • Functions across a wide variety of next-generation technologies and applications
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