STMicroelectronics

High-performance MEMS audio sensor

MP23ABS1
The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP23ABS1 has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio. The sensitivity of the MP23ABS1 is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz. The MP23ABS1 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
High-performance MEMS audio sensor
Features
  • Single supply voltage operation 1.52 V - 3.6 V
  • Omnidirectional sensitivity
  • High signal-to-noise ratio
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering
  • Enhanced RF immunity
  • Ultra-flat frequency response
  • Low latency
  • Ultra-low-power: 150 μA max
  • ECOPACK®, RoHS, and “Green” compliant

MP23ABS1
  • Temperature range: -40 to +85
  • Package: (3.5 x 2.65 x 0.98) mm
  • Packing: Tray
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