Subscribe to EDOM TECH Newsletter
xMEMS Labs
2025/08/14
xMEMS Labs Announces 3rd Annual “xMEMS Live Asia” Seminar Series in Taipei and Shenzhen
Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and µCooling on September 16 in Taipei and September 18 in Shenzhen
xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.
Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.
This year’s one-day seminars will center on live product demonstrations of Sycamore, xMEMS’ revolutionary thin and lightweight full-range MEMS loudspeaker, and µCooling, the world’s first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can’t go.
Attendees will experience:
- AI glasses featuring Sycamore speakers and µCooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear
- Next-gen headphones featuring full-range Sycamore, paired with µCooling to deliver the world’s first active earcup ventilation
- SSD thermal management featuring µCooling for higher sustained data transfers
- Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing µCooling at both chip and system levels
In addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and µCooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics.
“AI is changing how we interface with devices while also increasing processor and thermal loads,” said Joseph Jiang, CEO of xMEMS Labs. “At xMEMS Live Asia, we’ll demonstrate how Sycamore and µCooling technologies are enabling a new generation of thinner and lighter weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance.”
Registration is now open. Seating is limited. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!
For more information about xMEMS and its solid-state solutions, visit xmems.com. For hi-res imagery, click here.
Source: xMEMS
