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2025/10/27
2025/10/27 ~
Affordability, Reliability, and Efficiency on a Chip
Affordability, Reliability, and Efficiency on a Chip
Cost-Optimized and Secure: A Next-Gen SoC for Long-Range IoT
Silicon Labs has officially announced the FG23L wireless system-on-chip (SoC), expanding its Series 2 portfolio with a solution designed for cost-conscious, high-volume IoT applications. Compared to the original FG23, this "lite" variant is designed for balancing performance, cost, and efficiency for a wide range of applications like smart cities and industrial automation. The FG23L delivers secure, long-range wireless connectivity, expanding Sub-GHz IoT accessibility worldwide. Developer kits are now available, helping engineers jump-start next-generation designs.
A Breakthrough in Range, Battery Life, and Security
The FG23L SoC specifically addresses the growing need for applications that don't rely on resource-intensive tasks such as driving a display or user interface. Optimized for long-range communication and ultra-low power consumption, it achieves nearly twice the range of competing chips while offering over 10 years of battery life, a critical advantage for large-scale IoT deployments like smart cities, building automation, and industrial monitoring.
Consuming just 36 µA EM0 @ 78 MHz (up to 40% less active power than comparable solutions) and maintaining only 1.2 µA in EM2 DeepSleep mode with 16 kB RAM retention, it matches the full-featured FG23’s low-power advantages. Powered by a fast Cortex-M33 processor, dual-core wireless architecture, Secure Vault™ Mid technology, and developer-friendly tools like Simplicity Studio 5 and the Radio Configurator, the FG23L combines performance, protection, and efficiency in one compact solution.
Empowering Cost-Sensitive Markets at Scale
By uniting affordability, robust security, and long-range performance, the FG23L brings exceptional value for a wide range of IoT applications from industrial sensors and smart agriculture to digital price tags and infrastructure systems. Its compact, scalable design allows manufacturers to deliver reliable, competitively priced products that can evolve alongside market needs. With seamless compatibility across Silicon Labs’ Sub-GHz portfolio, the FG23L offers a clear upgrade path with the secure, intelligent wireless connectivity accessible to all.
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T5838 - Digital MEMS Microphone
TDK InvenSenseThe T5838 is a multi-mode, low noise digital MEMS microphone in a small package. It consists of a MEMS microphone element and an impedance converter amplifier followed by a fifth order Σ-Δ modulator. The digital interface allows the pulse density modulated (PDM) output of two microphones to be time multiplexed on a single data line using a single clock.
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SiC Power Module
ROHMIn fully SiC-based modules that integrate SiC MOSFETs and SBDs, switching losses are drastically reduced, achieving far greater performance than equivalently rated silicon IGBT modules. This leap in efficiency translates directly into smaller, cooler, and more sustainable power systems.
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N116BCA - 11.6” TFT Liquid Crystal Display Module
InnoluxN116BCA is a 11.6” (11.6” diagonal) TFT Liquid Crystal Display NB module with LED Backlight unit and 30 pins eDP interface. This module supports 1366 x 768 WH mode and can display 16,777,216 colors, ideal for notebook and compact IoT appliance.
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MCOIL™ Metal Power Inductors
Taiyo YudenMCOIL™ Metal Power Inductors are coil components that use metallic magnetic materials optimized for use in choke coils for power supply circuits. They are ideal for various electronic devices, including smartphones, wearables, IoT devices, automotive, industrial equipment, and medical devices that are becoming more compact, thin, and feature-rich.
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