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Mobile 5G Solutions
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New Solutions Accelerate your 5G innovations
High-speed transmission, low latency, and high reliability are the three major features of 5G. Some experts pointed out that smartphones will be an indispensable medium for structuring the IoT ecosystem based on its high mobility and popularity, and more importantly, it will play a significant role in the field of smart IoT.
According to the recent report released by Strategy Analytics, 5G smartphones will be the fastest growing area in the industry this year. In order to grow in the fiercely competitive market, each major manufacture would certainly need to strengthen its UI/UX and develop innovative features. Recently, we've seen that mobile phone manufacturers have launched a wide variety of most innovative features such as folding phones, all-screen design, under-screen fingerprint recognition, sound on display, multi-lens configuration, ultra-high resolution display, and upgraded artificial intelligence. Those are all focused on the need of 5G generation.
EDOM Technology's mobile communication platform team is committed to providing the most professional technical services and one-stop solutions. Our vendor, Boreas Technology, launched Piezo Haptic Driver IC which can effectively optimize the user's response feedback and the design cost of the phone case. Furthermore, the integrated design will effectively improve the level of waterproof. The solution features diverse functional components from RF IC, sensors, Wi-Fi modules, memory, to power control. Our one-stop solution can meet any developer's innovative needs.
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| Product | Product Description | Product | Product Description |
| RF |
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Screen |
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| Sensor |
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Camera |
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| Connectivity |
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Power |
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| Memory |
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Audio |
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| Application Processor |
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Passive |
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| Connector |
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Piezo Haptic Driver - BOS1901
is a single-chip piezo actuator driver with energy recovery, based on patented CapDrive™ technology. It can drive actuators with up to 190 Vpk-pk waveforms while operating from a 3-5.5 V supply voltage. The input digital stream is written in the internal FIFO over the digital interface to generate the desired output waveform. Learn More >>
5G Massive IoT System-in-Package - SKY66430-11
is a multi-band multi-chip System-in-Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms. The SiP integrates the entire RF front end, transceiver, power management, memory, and baseband modem for an LTE multi-band radio operating in the 698 to 2200 MHz frequency range. Learn More >>
Always-on 3D accelerometer and 3D gyroscope - LSM6DSR
is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended full-scale range for the gyroscope, up to 4000 dps, and high stability over temperature and time. Learn More >>
Tristimulus Color Sensor - TCS3430
features advanced digital ambient light sensing (ALS) and CIE 1931 tristimulus color sensing (XYZ). Each of the channels has a filter to control its optical response, which allows the device to accurately measure ambient light and sense color. Learn More >>
