TWS Earbuds Solutions

TWS Earbuds Solutions



[Tradition Chinese] | [Simplified Chinese]
TWS is now all the rage as chip technologies play a key role

True wireless stereo (TWS) earbuds market has grown rapidly. According to Counterpoint Research, the global shipments of TWS earbuds will reach 230 million in 2020 with a compound annual growth rate (CAGR) of 80% from 2019 to 2022. With the introduction of Bluetooth 5.0, the communication speed, distance, and capacity of TWS earbuds have been greatly improved. Nowadays, in addition to the focus of appearance size and refinement, how to deal with the complex use scenarios and enhance the anti-interference capability, accelerating binaural synchronization, and integrating with the functions of voice biometric authentication, health detection, and wireless charging are the key indicators pursued by every leading manufacturer. 

Unlike traditional earphones, TWS removes the physical wire restraint and give earbuds the edge of multiple functions and better UI. How to ensure the noise-canceling effect, voice recognition rate, and the stability of binaural communication are the major challenges to the leading TWS earbuds brands. EDOM Technology is committed to providing the cutting edge solution to our partners with the latest processors, Bluetooth chips, power management chips, MEMS microphones, MEMS accelerometers, and bone conduction sensors.


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TWS Platform

TWS Earbuds Block Diagram

TWS Block Diagram
 
  • ams AG - IR Proximity Detection Module

    ams AG - IR Proximity Detection Module

    TMD2635 is an advanced IR proximity sensor module suited for short-range proximity measurement detection and offered in the industry's smallest size (1.0mm x 2.0mm) and thin (0.5mm) optical land grid array module that incorporates a 940nm IR VCSEL and is factory calibrated for IR proximity response.  [Learn More]

  • STMicroelectronics - Bone Conduction Sensor

    STMicroelectronics - Bone Conduction Sensor

    LIS25BA is a low-noise high-bandwidth three-axis digital accelerometer. The LIS25BA has a full scale of ±3.85 g and works with a Time-Division Multiplexing (TDM) interface. [Learn More]

  • TDK InvenSense - MEMS Microphone 

    TDK InvenSense - MEMS Microphone 

    TDK InvenSense’s analog (ICS-40212) and digital (ICS-41350) microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. [ICS-40212] [ICS-41350]

  • SONY - Audio Codec IC

    SONY - Audio Codec IC

    Sony’s CXD3781 ANC technology is based on digital, it is high-quality, high-performance, and low power. It offers flexibility ANC design and powerful suppression of ambient noise easily. [Learn More]

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