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2024/08/29
A Cool Solution for a Hot Problem
A Cool Solution for a Hot Problem
For all electronic devices, no matter the size, they all encounter the same issue. Heat.
This is especially true as the solutions and machines they are a part of get more complex, such as laptops, smartphones, tablets, and more. Computers and laptops require additional cooling components, like build-in fans. But smart phones and tablets lack the space for these cooling components, a problem that has become more and more common as mobile computing devices begin to run more processor-intensive applications such as AI applications. The solution isn't to make those mobile devices bigger, but to make the cooling components smaller.
xMEMS introduces the xMEMS XMC-2400 µCooling™ chip, the first active micro-cooling fan for ultramobile devices. Manufacturers can, for the first time, integrate active cooling into mobile devices, with a silent, vibration-free, solid-state, 1mm chip. With AI becoming a rapidly expanding hot topic, a micro-cooling fan will be invaluable for the future of AI solutions. For more information about xMEMS and its μCooling solutions, click the link below!
xMEMS will begin demonstrating XMC-2400 to lead customers and partnersin September at its xMEMS Live events in Shenzhen and Taipei. For moreinformation on xMEMS Live events, click the link below!
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SKY66430-115G Massive IoT System-in-Package
SkyworksThe SiP integratesthe entire RF front end, transceiver, power management, memory, and basebandmodem for an LTE multi-band radio operating in the 698 to 2200 MHz frequencyrange. NOR flash, crystals, and a few passives external to the package completethe SiP implementation.
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BOS1901| Piezo Haptic Driver
Boréas TechnologiesThe BOS1901 is asingle-chip piezo actuator driver with energy recovery, based on Boréas'patented CapDrive™ technology. It can drive actuators with up to 190Vpk-pk waveforms while operating from a 3-5.5 V supply voltage.
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AudioSmart®Far-Field Voice DSPs
SynapticsCX22721, CX20921, CX20924
Delivering a smartdigital assistant is a now a topic that dominates the boardrooms of many majorIoT companies. As voice activation and artificial intelligence (AI) transformthe smart device market, engineering teams strive to deliver extraordinary experiencesto customers through conservational speech.
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STM32L4+| Ultra-low-power MCU
STMicroelectronicsST has extended theSTM32L4 technology providing more performance (up to 120MHz), more embedded memory (up to 2 Mbytes of Flash memory and 640Kbytes of SRAM) and richer graphics and connectivity features whilekeeping our best-in-class ultra-low-power capability.
[Learn More]
Event Information
EDOM will be joiningSilicon Labs in Electronica India 2024. At this event, EDOM Technology will bepartnering with Silicon Labs to showcase its intelligent wireless technologiesand applications, focusing on the following key areas:
- Bluetooth: Discover the latest advancements in Bluetooth integration and optimization across various devices and IoT applications.
- Matter: Explore how Matter is simplifying and unifying the smart home ecosystem, enabling seamless interoperability.
- Wi-Fi: See innovations in Wi-Fi applications that address high-speed connectivity and low-power requirements.
- Wi-SUN: Learn how Wi-SUN technology is driving large-scale IoT networks in smart city deployments.
For more details or to schedule a meeting, please feel free to contact us sales@edomtech.com
