Subscribe to EDOM TECH Newsletter
2025/09/24
Smart Glasses Reinvented: Sound and Comfort in Harmony
Smart Glasses Reinvented: Sound and Comfort in Harmony
xMEMS Labs’ two breakthrough technologies make truly “all-day comfort” possible for AI smart glasses: the Sycamore MEMS speaker and the µCooling micro fan chip. Together, they tackle the two biggest challenges of smart glasses, bulky audio hardware and heat build-up in the frames. With a slimmer design and efficient cooling, AR/XR smart glasses can now deliver powerful performance while remaining as natural and comfortable to wear as regular eyewear.
Ultra-Thin Speaker Engineered for Next-Generation Mobile Devices
Sycamore is the world’s thinnest high-fidelity speaker, measuring just 1.28 mm in thickness and weighing under 150 mg, 70% smaller and 90% lighter than traditional coil speakers. Powered by xMEMS’ ultrasonic speaker platform, Sycamore delivers a full audio spectrum with refined highs and lows, outstanding mid-bass performance, and up to 15 dB enhanced high-frequency extension. Built with an all-silicon structure and IP58-rated for water and dust resistance, it is ideally suited for open-wireless stereo (OWS) earbuds, smartwatches, smart glasses, and AR/VR headsets, providing a full-range audio experience that combines professional performance with sleek design.
Active Cooling Optimized for AI Era’s Thermal Management
Complementing this is µCooling, the first active cooling solution built directly into a glasses frame. Each chip—about 9×8×1 mm—houses a solid-state micro-fan that circulates up to 39 cm³ of air per second and 1,000 Pa back pressure. By quietly pulling heat away at ultrasonic frequencies, µCooling lowers surface temperatures by up to 40% and improves thermal headroom by 70%, all while consuming just ~30 mW of power. The result: processors can run longer and harder without the glasses getting warm against the skin.
Practical Comfort, Redefined for AI Eyewear
Together, Sycamore and µCooling are set to open up a brand-new, comfortable wearing experience for wearable AI. Users get AI glasses viable for all-day use and natural, open-ear sound and frames that stay cool through voice assistance, translation, navigation, or productivity tasks. For designers, the freed-up space can support larger batteries or more sensors. For wearers, it means eyewear that feels as natural as it looks, heralding a new era where AI smart glasses are truly practical for everyday life.
-
XMC-2400 - Active Cooling Fan on a Chip
xMEMSThe first-ever all-silicon, solid-state active micro cooling chip revolutionizes thermal management for ultra-mobile systems and next-generation AI solutions. The fan can push the limits with bi-directional and adjustable airflow up to 39 cm³/sec. and 1,000 Pa back pressure, enabling mobile devices to sustain maximum performance at lower operating temperatures and without processor throttling.
[Learn More] -
Sycamore - Near-Field MEMS Loudspeaker
xMEMSSycamore is the world’s first 1mm-thin near-field, all-silicon, full-range MEMS loudspeaker for open wireless stereo (OWS) earbuds, smart watches, smart glasses, XR headsets, and other compact, mobile electronics. With higher low-frequency SPL compared to dynamic drivers, the speaker is ideal for near-field open-air applications for crisp, detailed phone calls, podcasts and music.
[Learn More]
-
AS33980 - AudioSmart® SoC
SynapticsThe AS33980 SoC offers cutting-edge technology that leverages the flexibility of Synaptics’ Neural Processing Unit (NPU) to utilize use-case-specific Deep Neural Network (DNN) models to provide both ENC and hybrid ANC in extremely noisy environments. Applications include advanced wireless solutions and USB Type-C for mobile, immersive gaming headsets, as well as UC office communications headsets.
[Learn More] -
STM32U5 - Ultra-Low Power MCU
STThe STM32U5 is the first 32-bit MCU to integrate up to 4 Mbytes of flash memory. Powered by the Arm® Cortex®-M33 core, the series delivers advanced power-saving capabilities while meeting the most demanding power and performance requirements. It is designed for next-generation smart applications such as wearables, HMI devices, personal medical equipment, home automation, and industrial sensors.
[Learn More]
