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Lotus Microsystems
LTG - Electrically-Isolated SMT Thermal Jumper
LTG0201, 0402, 0603, 0805, and 1206
Thermally conductive yet electrically isolated silicon-based thermal jumpers
Product Introduction
LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0201, 0402, 0603, 0805, and 1206) as well as custom sizes.
LTG is Lotus Microsystems’ patented technology.
Designed for Various Applications
LTG family is well-suited for:- Optical Transceivers: LTGs help equalize temperature across high-speed optical electronics and photonics, ensuring reliable high-data-rate performance.
- High-Power LED Systems: LTGs provide a low-resistance thermal path from LED junctions to the heatsink while preserving full electrical isolation — essential for high-brightness lighting.
- FPGA Designs: In high-IO, high-logic FPGA packages, LTGs transfer heat away from hotspots, maintaining timing stability, reducing thermal throttling, and enhancing processing speed.
- PIN & Laser Diodes: LTGs remove localized heat to protect optical output power, wavelength stability, and device longevity — critical for telecom and optical sensing modules.
- Power Amplifiers: LTGs stabilize PA junction temperatures by creating a low-resistance thermal path, improving linearity and extending device lifetime.
- Filters & Synthesizers: By reducing temperature rise and gradients, LTGs minimize frequency drift for more precise and stable RF performance.
- E-Bike Motor Systems: Lotus Thermal Guides efficiently extract heat from power stages, gate drivers, and control electronics within compact motor housings.
- Drone Electronics: Compact drone modules generate significant localized heat in flight processors, power converters, flight controllers, and RF links.
Key Features
- High thermal conductivity
- Low capacitance
- High insulation resistance
- Low CTE
Reference Design
Thermal Management Improvement of Circuit Protection Dual MOSFETsModern dual MOSFETs continue to increase in power density while package sizes become smaller. In common-drain configurations, thermal management is particularly challenging because the electrically active drain node cannot be directly connected to a grounded heatsink or large cooling plane. As a result, the available copper area for heat spreading is limited, leading to higher device temperatures, increased conduction losses, reduced system efficiency, and accelerated component ageing that may shorten device lifetime.
LTG devices provide an electrically isolated thermal path that transfers heat away from the electrically active nodes to a larger grounded copper area without creating an electrical connection.
Application Note
The application note evaluates LTG0402 and LTG0603 implementations using dedicated evaluation boards. Thermal imaging and electrical measurements compare boards with and without LTGs under identical operating conditions. Testing demonstrated up to 42.9°C lower device temperature, 7.04% lower conduction losses, and improved efficiency.
*Lotus Microsystems Authorized Distributor
